Webinar: Thermal Conductivity Testing for AI Data Centers

As AI and high-performance computing drive power densities ever higher, thermal management in data centres increasingly depends on the materials used throughout the electronics and cooling systems. From thermal interface materials and electronic substrates to encapsulants, adhesives and liquid coolants, thermal conductivity determines how efficiently heat is carried away from sensitive components.

This webinar explores thermal conductivity testing for the key materials of next-generation data centres, including the measurement challenges specific to each type: thin and compressible TIMs, anisotropic substrates, filled polymers, encapsulants, adhesives and low-viscosity cooling fluids. It also examines how sample thickness, contact pressure, filler distribution, temperature and convection influence results.

What you will learn

• Testing approaches for material screening, supplier data validation and formulation development
• Quality control and performance testing under representative operating conditions
• Selecting the right measurement method for the material form, conductivity range, sample geometry and application

Presented by C-Therm together with Dublin Analytical. Register below and our team will confirm your participation and share the joining details by email.